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Dip and Wave Method of Soldering

Dip and Wave Method of Soldering - Dip soldering consists of dipping assembled, flux coated joints into pools or baths of liquid solder. These baths, which supply both heat and solder to the joints, may vary in size from 2 to 4500 kgs.
Dip method has the, advantage that the entire unit comprising any number of joints can be soldered in one operation thereby increasing production volume at minimum cost of equipment. Fixtures are needed to hold the unit and maintain proper clearances.
Many types of equipment, as listed below, are dip soldered:
(i) Electrical pigtail or lug joints,
(ii) Electric motor armatures,
(iii) Radiators of all types,
(iv)Cans of all types,
(v) Electronic gear such as printed circuits.

Wave soldering method was developed to eliminate some of the drawbacks of dip soldering such as drags (caused due to overheating of molten solder in the bath) and skimming and to shorten soldering time by reducing the dynamic movement of the solder over the surface (a 75 to 80% reduction). This shorter time reduces warpage; air, flux and vapour entrapment, etc.
In wave soldering method, the parts to be soldered are carried by a conveyor touching the top portion of the solder wave produced by pumping out the molten solder out of a narrow slot. Typical wave speed is about 30 cm per second and parts are in contact with the wave for about 15 cm.

Wave soldering is a very economical mass soldering method; however defects in wave soldering continue to be a cause of concern. The main causes of defects are icicle formation and bridging. Both of these are caused by excessive amounts of solder being deposited on a terminal or conductor path.

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